Ceramics International

Ceramic International
ISSN: 0272-8842

For further information and subscription:
Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties.

Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour.

Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.

Ceramics International is particularly keen to attract papers which deal with fundamental scientific aspects that are relevant to the development of the whole range of advanced ceramics including e.g. phase equilibria and transformations, reactivity, transport processes, thermodynamic and electronic properties, as well as quantum effects in low dimensional materials.

Priority materials and areas of interest are:
  • Advanced ceramics and composites for civil, military and industrial applications at room and moderate temperatures. High and ultrahigh temperature structural ceramics and composites for use in extreme environments;
  • Electroceramics such as dielectric and microwave ceramics, ferroelectrics, piezoelectrics, pyroelectrics, thermoelectrics, ferroelastics; magnetic, multiferroic, semiconducting and fast ion-conducting ceramics; high Tc superconductors, topological insulators;
  • Optical ceramics including luminescent and chromogenic materials, transparent conducting and semiconducting ceramics, electro-optical, magneto-optical and laser materials, inorganic optical fibers, plasmonic structures and electromagnetic metamaterials;
  • Ceramics for nuclear fission, fusion and nuclear waste management technologies;
  • Bioinert and bioactive ceramics for the full range of medical applications, including functional nanoparticles, composite materials and hybrid hierarchical nanostructures for tissue engineering, delivery systems, bio imaging and neural interfaces.


General Editor:
P. Vincenzini, World Academy of Ceramics, Faenza, Italy

Editors in Chief:
Bordia R.K., Clemson University, Clemson, USA
Fu Z.Y., Wuhan University, Wuhan, China
Ohji T., AIST Chubu, Nagoya, Japan
Pandolfelli V.C., Federal University of Sao Carlos, Sao Carlos, Brazil
Riedel R. , Darmstadt University, Darmstadt, Germany

Editorial Board:
Agrawal D.K., The Pennsylvania State University, University Park, USA
Akbar S.A., Ohio State University, Columbus, USA
Asthana R., University of Wisconsin, Stout, Menomonie, USA
Barsoum M.W., Drexel University, Philadelphia, USA
Bennett J.P., Albany Research Center, US Department of Energy, Albany, USA
Best S.M., University of Cambridge, Cambridge, U.K.
Byrappa K., University of Mysore, Manasagangotri, India
Chang J., Shanghai Institute of Ceramics, Shanghai, China
Chen L.D., Shanghai Institute of Ceramics, Shanghai, China
Colombo P., Padova University, Padova, Italy
Danzer R., Montanuniversitaet Leoben, Leoben, Austria
Dominguez Rodriguez A., Universidad de Sevilla, Sevilla, Spain
Dondi M., CNR-ISTEC, Faenza, Italy
Dusza J., Institute of Materials Research of SAS, Košice, Slovakia
Fantozzi G., INSA- Lab. MATEIS, Villeurbanne, France
Fauchais P., Centre Europeen de la Ceramique S.P.C.T.S., Limoges, France
Ferreira J.M.F., University of Aveiro, Aveiro, Portugal
Gauckler L., ETH Zurich, Zurich, Switzerland
Gladfelter W.L., University of Minnesota, Minneapolis, MN, USA
Glaeser A., University of California, Berkeley, USA
Goto T., Tohoku University, Sendai, Japan
Haberko K., AGH University of Science and Technology, Krakow, Poland
Hannink R.H.J., C.S.I.R.O., Clayton, Victoria, Australia
Ishikawa T., Tokyo University of Science, Yamaguchi, Japan
Jones J., Imperial College, London, UK
Kang S-J-L., KAIST, Yuseong-Gu, Daejeon, Korea
Kim H-D., Korea Institute of Materials Science, Changwon City, Korea
Komarneni S., The Pennsylvania State University, University Park, USA
Koumoto K., Nagoya University, Nagoya, Aichi, Japan
Krenkel W., Bayreuth University, Bayreuth, Germany
Leite E.R., Federal University of Sao Carlos, Sao Carlos, Brazil
Lin H-T., Guangdong University of Technology, Guangzhou, China
Lis J., AGH University of Science and Technology, Krakow, Poland
Llanes Pitarch L.M.,University Politecnica de Catalunya, Barcelona, Spain
Mandal H., Sabanci University, Istanbul, Turkey
Okada K., Tokyo Institute of Technology, Tokyo, Japan
Oprea G., The University of British Columbia, Vancouver, Canada
Pierre A., Rochetaillee Sur Saone, France
Poirier J., CNRS, CEMHTI, Orleans, France
Ramesh S., University of Malaya, Kuala Lumpur, Malaysia
Rey C., CIRIMAT – ENSIACET, Toulouse, France
Rogachev A.S., ISMAN - RAS, Chernogolovka, Russia
Safari A, Rutgers University, Piscataway, USA
Sigmund W., University of Florida, Gainesville, FL, USA
Singh M., NASA Glenn Research Center, Cleveland, OH, USA
Srivastava V.K., Indian Institute of Technology, (BHU), Varanasi, India
Tuan W-H., National Taiwan University, Taipei, Taiwan
Watari K., AIST, Nagoya, Japan
Wiederhorn S., NIST, Gaithersburg, MD, USA
Yamane H., Tohoku University, Sendai, Japan
Yamashita K., Tokyo Medical and Dental University, Tokyo, Japan
Yoon K.H., Yonsei University, Seoul, Korea
Zhou Yanchun, Aerospace Research Inst. of Materials and Processing Techn., Beijing, China
Zhou Yu, Harbin Institute of Technology, Harbin, China
Zhu W., Nanyang Technological University, Nanyang, Nil, Singapore
ico-info Address
  • Sede legale : via dei Bianchi n.19
  • 47121 - Forlì (FC)
  • email: info@technagroup.it
  • R.E.A. 297724
  • reg. Imp. Forlì-Cesena
  • Capitale sociale: EURO 20.000,00 interamente versato
© 2017 Techna Group s.r.l. - Faenza - Italy - VAT 03368230409 - Daisuke Ecommerce